Inner layer imaging

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Both wet and dry film, auto-exposure machines from Japan, horizontal etching lines from Germany, enhancing the capability to produce min. 40μm -thick CCL and min. width/gap 40μm/40μm.

Laminating

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Leading integrated hot and cold laminating machines from Germany, able to process up to 40-layer PCB. Pressing the min. thickness of 0.20mm, the max. thickness of 5mm or more, with excellent thickness uniformity.

Mechanical drilling

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HITACHI CNC drilling machines to ensure the min. hole diameter of 0.10mm with high precision.

Laser drilling

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HITACHI CNC laser drilling machines to ensure the min. hole diameter 0.075mm, drilling speed 20,000 holes / min or more, high-density interconnect board producing.

Copper plating

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Pulse plating / Continuous vertical panel plating,special tools for 40μm -thick CCL,to achieve Aspect Ratio with 20:1 and good copper distribution COV≤6%.

Copper electroplating microvia filling

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Applying selected special chemical additives,optimised electroplating process parameter,together with the appropriate electroplating equipment,to fulfil the high-end customer's requiremnet on high quality of high board thickness to via diameter ratio blind via and through via filling capability,to ensure the reliability of the HDI PCB.

Solder mask print

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E-spray technology, able to print over 0.1mm thin PCB, and max.12 oz heavy copper with solder mask thickness≥5um on trace edge.

Electrical Test

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Four-terminal tester, the min. test pad diameter at 0.1mm, min. test resistance at 10 milliohms to ensure quality and reliability of the HDI PCB.

Special carbon printing

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Special configuration of the carbon & dielectrical paste print line, life test up to 18 million cycles to ensure product reliabilities.