Smallest Trace Width/Space
: 75/75um
inner layer copper thickness
: 1/3oz - 3oz
inner layer core thickness
: ≥0.050mm
Min. hole (Mechanical)
: 0.2mm
Min. hole (Laser)
: 0.1mm
Min.space from hole to line
: 0.18 (PTH) / 0.15 (NPTH)
Max PCB Finish Boardsize
: 533*610mm
Layer Capability
: 2L - 26L
Board Thickness tolerance
: ±10%
HDI(Build up
: 1+N+1
2+N+2 Min L/S≥75/75um
Aspect Ratio
: 15(¢0.2mm/3.0t) PTH
0.8 LVH
Finish hole tolerance
: ±0.08mm PTH
±0.05mm NPTH
Material
: FR-4(High TG、Halogen Free、High-frequency), RCC, FR408, NELCO
Impedance Control
: ±10%
Surface treatment
: OSP,HASL(Sn/Pb), Immersion Tin(Sn), Immersion Gold(Ni/Au)
Copper plation thickness
: ≥20um
Immersion Gold Thickness
: Gold 0.03-0.76um
Nickel 2.5-5um
Gold Finger
: Gold 0.76-1.5um
Nickle 2.5-5um
HAL lead free thickness
: 0.5-50um (SMD pitch<1/5)
Immersion Tin thickness
: 0.8-1.2um
Solder Mask Color
: Green/Red/Black/Blue
V-cut Angle
: 30°, 45°, 60°
V-cut Deepth Tolerance
: ±0.15mm
SMD Pitch
: 1/5
BGA Space
: 0.5mm
Outline Tolerance
: ±0.1mm
Special Technics
: Edge plating,Counter sink,Carbon Ink,Insulating solder mask,
Peelable resist