Smallest Trace Width/Space
:   75/75um
inner layer copper thickness
:   1/3oz - 3oz
inner layer core thickness
:   ≥0.050mm
Min. hole (Mechanical)
:   0.2mm
Min. hole (Laser)
:   0.1mm
Min.space from hole to line
:   0.18 (PTH) / 0.15 (NPTH)
Max PCB Finish Boardsize
:   533*610mm
Layer Capability
:   2L - 26L
Board Thickness tolerance
:   ±10%
HDI(Build up
:   1+N+1
 
    2+N+2 Min L/S≥75/75um
Aspect Ratio
:   15(¢0.2mm/3.0t) PTH
 
    0.8 LVH
Finish hole tolerance
:   ±0.08mm PTH
 
    ±0.05mm NPTH
Material
:   FR-4(High TG、Halogen Free、High-frequency), RCC, FR408, NELCO
Impedance Control
:   ±10%
Surface treatment
:   OSP,HASL(Sn/Pb), Immersion Tin(Sn), Immersion Gold(Ni/Au)
Copper plation thickness
:   ≥20um
Immersion Gold Thickness
:   Gold 0.03-0.76um
 
    Nickel 2.5-5um
Gold Finger
:   Gold 0.76-1.5um
 
    Nickle 2.5-5um
HAL lead free thickness
:   0.5-50um (SMD pitch<1/5)
Immersion Tin thickness
:   0.8-1.2um
Solder Mask Color
:   Green/Red/Black/Blue
V-cut Angle
:   30°, 45°, 60°
V-cut Deepth Tolerance
:   ±0.15mm
SMD Pitch
:   1/5
BGA Space
:   0.5mm
Outline Tolerance
:   ±0.1mm
Special Technics
:   Edge plating,Counter sink,Carbon Ink,Insulating solder mask, Peelable resist